 PTH Treatment Process : ( 貫孔电镀制程 ) A PTH process has the function, to build up a conductive layer on the nonconductive areas. The classical PTH process based on electroless copper is most widely in operation and provides a high reliability. Jetchem's alkaline activator system, provides a very dense and uniform Palladium layer, with an excellent initial coverage power to the electroless copper.
贯孔电镀制程主要于PCB非导电区域形成导电层。传统化学銅方式为最稳定、信赖度最高的方法。超特提供鹼性的纯肥系统,把能密集且均勻吸附于非导电区域,形成良好催化环境,使化學铜能完整覆蓋。
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Type of Electroless copper : ( 多种化学铜型态 ) Low Speed (Tartaric or EDTA): / 薄銅 Electroless Copper 168 μm/h : 1.2 - 1.7 Electroless Copper ECT μm/h : 1.2 - 1.7 Electroless Copper ECT-H μm/h : 1.8 - 2.5 Electroless Copper EC μm/h : 0.7 - 1.3
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Medium Speed (Based on Tartaric acid) 中速铜 |
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Electroless Copper MC μm/h : 2.6 - 3.0 |
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High Speed (Based on Quadrol) 厚化铜 |
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Electroless Copper 910 μm/h : 4.0 - 6.0 |
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